3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
On June 23, 2025, Rapidus announced a strategic collaboration with Siemens Digital Industries Software to enhance semiconductor design and manufacturing processes for the 2nm technology node. The ...
TOKYO, SEMICON Japan, Dec. 10, 2024 – Rapidus Corporation, a manufacturer of advanced logic semiconductors, today announced that it has signed an agreement with Synopsys Inc., a provider of silicon to ...
The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...
Visakhapatnam: Centurion University of Technology and Management (CUTM) in Andhra Pradesh has set up the Dreamchip Siddhi – VLSI Semiconductor Design .
The chiplet model has been proven by the early adopters. Large companies that successfully developed chips at leading nodes have integrated multiple chiplets into systems, where the entire silicon ...
The automotive industry is experiencing a significant transformation as it adopts innovations like autonomous driving technologies and ultra-connected ecosystems. At the core of this change is a ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results